In its third consecutive year, the xMEMS Live Asia 2025 Seminar Series was held in Taipei and Shenzhen, showcasing cutting-edge AI audio interfaces and thermal management solutions that enhance on-device intelligence and system performance.
Together, they are redefining the design and performance of next-gen AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.
A huge thank you to our attendees, customers, and distribution partners EDOM and SAC for making the seminar a massive success and being a key part of this exciting journey.
Together, we are redefining sound and cooling in the AI era with our breakthrough piezoMEMS platform enabling thinner, lighter designs that deliver crystal-clear sound, precise thermal control, and all-day comfort.
