Meet xMEMS at
MWC Barcelona 2026

2-5 March, 2026 | Barcelona, Spain

Join us at booth 7G20 to experience µCooling™ thermal management and MEMS loudspeaker solutions powering the next-generation of Edge AI thermal management and audio interfaces.

Thinner, Lighter, Cooler AI-Driven Smartphones and Smart Glasses

PiezoMEMS components eliminate thermal throttling, enhance clarity for AI voice interactions, and enable thinner, lighter devices, from smart glasses to smartphones.

World’s First Active Thermal Management Solution
for Smartphones

Advanced cooling built for AI-class
processors in compact, high-performance
edge AI systems.

World’s First Active Cooling and 
Lightest & Smallest Speaker
for
AI Glasses

Thinner, lighter designs that deliver crystal-clear sound, precise thermal control, and all-day comfort.

Book Your Meeting / Product Demo

Meet us at booth 7G20!

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Explore More Solutions for Edge AI
Thermal Management and Audio Interfaces