CES 2027 - xMEMS Labs

Experience the Future of Edge AI

6-9 January 2027 | Las Vegas, NV

Private demonstrations of breakthrough thermal management and solid-state audio technologies for AI glasses, smartphones, wearables, storage, and next-generation Edge AI devices.

Edge AI Demands More Than Compute

As Edge AI devices become more intelligent, delivering more compute in a smaller form factor is no longer enough. Device makers must also solve for heat, power, comfort, acoustics, battery life, and industrial design, often simultaneously. At CES 2027, xMEMS Labs will demonstrate how our revolutionary PiezoMEMS platform is helping manufacturers, OEMs, and ODMs, overcome these challenges with breakthrough thermal management and audio technologies.

THE INDUSTRY CHALLENGE

Edge AI's Next Bottleneck Isn't Compute. It's Physics.

As AI processors continue to advance, product teams face growing challenges managing heat, power consumption, weight, comfort, battery life, and acoustics without compromising performance or industrial design.

From AI glasses and smartphones to wearables, storage, and personal audio products, next-generation devices require innovative solutions that deliver more capability within increasingly constrained form factors.

xMEMS Labs is helping solve these challenges through a unified PiezoMEMS platform that brings breakthrough advancements in both thermal management and audio performance.

FEATURED CES DEMONSTRATIONS

See What's Next for Edge AI

Experience live demonstrations showcasing how device makers can create products that are smaller, lighter, cooler, and higher performing.

Advanced Thermal Management for AI Devices

See how xMEMS’ solid-state active cooling technologies help enable sustained AI performance in:

AI smart glasses
AR/XR wearables
AI processors and NPUs
Computer vision systems
Real-time translation platforms
AI assistants

Learn how device manufacturers can reduce thermal throttling, lower surface temperatures by up to 40°C, and improve power efficiency to support all-day wearable AI experiences.

PulseAir™ Solid-State Speakers

Discover the world’s smallest solid-state speakers for ultralight AI glasses, intelligent eyewear, heirloom OWS earbuds, and next-generation open-back headphones.

Up to 90% smaller and lighter than conventional speakers
1 mm thin and ultra-lightweight design
Enables smaller, lighter, and more comfortable wearable devices
Full-range audio performance in an unprecedented form factor

Solid-State µSpeaker Technology

Experience premium audio for hi-resolution and gaming headphones and studio in-ear monitors.

Enhanced sound quality and imaging
Faster, more responsive audio
High-resolution music and gaming experiences
Premium sound in thinner and lighter devices

µCooling™ Fan-on-a-Chip Technology

See the world’s first solid-state micro-cooling solution for:

AI smart glasses
Smartphones
SSDs
Headphones
Compact Edge AI systems

Delivering hyperlocalized cooling, µCooling™ technology enables lower operating temperatures, sustained peak performance, thinner product designs, and reduced thermal throttling.

See Shipping Products Powered by xMEMS

Explore commercial products from leading brands including:

PRIVATE MEETINGS & DEMO

Meet with xMEMS Labs at CES 2027

Join us in our private Venetian suite to experience the technologies helping shape the future of Edge AI.

Whether you're developing AI glasses, smartphones, wearables, premium audio products, storage solutions, or other Edge AI devices, we'd welcome the opportunity to discuss your roadmap and explore where xMEMS technology can create a competitive advantage.