Active µCooling™

For Mobile Electronics

XMC-2400: The World’s First 1mm-Thin Active Micro Cooling Fan on a Chip

The first-ever all-silicon, solid state active micro cooling chip revolutionizing thermal management for ultra-mobile systems and next-generation artificial intelligence (AI) solutions

Features & Benefits

1mm-thin

Up to 39cc/sec airflow per instance
Up to 1,000Pa back pressure per instance

Inaudible

Vibration-free

Semiconductor reliability and robustness

Water and dust resistant

A New Era of Active Micro Cooling

Thermal management is increasingly challenging, and passive heat spreaders are no longer sufficient on their own. xMEMS active µCooling, featuring an all-silicon, solid state fan at the chip level, can effectively generate airflow and quickly dissipates heat, enabling smartphones and other thin mobile electronics to operate that their maximum performance potential, without throttling.

XMC-2400

All-Silicon, Solid State Fan on A Chip for Active Micro Cooling

XMC-2400-S "Side Venting" (left)
XMC-2400 "Top Venting" (right)

XMC-2400-S "Side Venting" (left)

XMC-2400 "Top Venting" (right)

As the world’s first 1mm-thin active micro cooling fan on a chip, XMC-2400 is designed to actively cool even the thinnest handheld form factors.

Features

Package dimensions: 9.26_W x 7.6_L x 1.08_H mm
Top-venting and side-venting packages for flexible integration in different system form-factors
Bi-directional flow rate, adjustable up to 39cc/sec
Very robust (qualified to semiconductor quality standards)
IP58
Inaudible; all mechanical operation is at ultrasonic frequencies
SMT-reflowable
Efficient: estimated 30mW power consumption

Applications

Smartphones
Tablets
External solid-state drives (SSDs)
Wireless chargers
XR goggles
Laptops

Revolutionary Active Micro Cooling

A Breakthrough in Mobile Thermal Management

Watch the XMC-2400 in Live Action!

Pushing the Limits with Bi-directional and Adjustable Airflow up to 39 cc/sec. and 1,000 Pa Back Pressure

For the Thinnest,  Most High Performance, AI-Ready Mobile Devices

xMEMS’ active µCooling enables mobile devices to sustain maximum performance at lower operating temperatures and without processor throttling.

Here’s How You Can Experience XMC-2400

Upcoming Events

Westin Nanshan – Shenzhen

Illume Taipei – Taipei

Applications

Smartphones
Tablets
External solid-state drives (SSDs)
Xr goggles
Laptops
In-chip integration to 2d/3d-stacks

Active µCooling™

For Mobile Electronics

XMC-2400: The World’s First 1mm-Thin Active Micro Cooling Fan on a Chip

Features & Benefits

1mm-thin

Up to 39cc/sec airflow per instance Up to 1,000Pa back pressure per instance

Inaudible

Vibration-free

Semiconductor reliability and robustness

Water and dust resistant

A New Era of Active Micro Cooling

XMC-2400

XMC-2400-S "Side Venting" (left)XMC-2400 "Top Venting" (right)

XMC-2400-S "Side Venting" (left)

XMC-2400 "Top Venting" (right)

Revolutionary Active Micro Cooling

A Breakthrough in Mobile Thermal Management

Watch the XMC-2400 in Live Action!

Pushing the Limits with Bi-directional and Adjustable Airflow up to 39 cc/sec. and 1,000 Pa Back Pressure

For the Thinnest, Most High Performance, AI-Ready Mobile Devices

Here’s How You Can Experience XMC-2400

Upcoming Events

Applications

Up to 39cc/sec airflow per instance
Up to 1,000Pa back pressure per instance

XMC-2400-S "Side Venting" (left)
XMC-2400 "Top Venting" (right)

For the Thinnest,  Most High Performance, AI-Ready Mobile Devices