Active µCooling™

For Mobile Electronics

XMC-2400: The World’s First 1mm-Thin Active Micro Cooling Fan on a Chip

The first-ever all-silicon, solid state active micro cooling chip revolutionizing thermal management for ultra-mobile systems and next-generation artificial intelligence (AI) solutions

Features & Benefits 

1mm-thin 

Up to 39cc/sec airflow per instance
Up to 1,000Pa back pressure per instance 

Inaudible 

Vibration-free 

Semiconductor reliability and robustness 

Water and dust resistant

A New Era of Active Micro Cooling

Thermal management is increasingly challenging, and passive heat spreaders are no longer sufficient on their own. xMEMS active µCooling, all-silicon, solid state, fan on a chip, can effectively generate airflow and quickly dissipates heat, enabling smartphones and other thin mobile electronics to operate that their maximum performance potential, without throttling.

XMC-2400 Active Cooling Chip

All-Silicon, Solid-State Fan on A Chip for Active Micro Cooling

XMC-2400-S "Side Venting" (left)
XMC-2400 "Top Venting" (right)

XMC-2400-S "Side Venting" (left)

XMC-2400 "Top Venting" (right)

As the world’s first 1mm-thin active micro cooling fan on a chip, XMC-2400 is designed to actively cool even the thinnest handheld form factors.

  • Package dimensions:  9.26W x 7.6L x 1.08H mm
  • Top-venting and side-venting packages for flexible integration in different system form-factors
  • Bi-directional flow rate, adjustable up to 39cc/sec

  • Very robust (qualified to semiconductor quality standards)
  • IP58
  • Inaudible; all mechanical operation is at ultrasonic frequencies
  • SMT-reflowable
  • Efficient: estimated 30mW power consumption
  •  
  • Smartphones
  • Tablets
  • External solid-state drives (SSDs)
  • Wireless chargers
  • XR goggles
  • Laptops

Revolutionary Active Micro Cooling

A Breakthrough in Mobile Thermal Management

Watch the XMC-2400 in Live Action!

Pushing the Limits with Bi-directional and Adjustable Airflow up to 39 cc/sec. and 1,000 Pa Back Pressure

For the Thinnest,
Most High Performance, AI-Ready Mobile Devices

xMEMS’ active µCooling enables mobile devices to sustain maximum performance at lower operating temperatures and without processor throttling.

Here’s How You Can Experience XMC-2400

Upcoming Events

Westin Nanshan – Shenzhen

Illume Taipei – Taipei

Applications

  • Smartphones
  • Tablets
  • External solid-state drives (SSDs)
  • Xr goggles
  • Laptops
  • In-chip integration to 2d/3d-stacks