The first-ever all-silicon, solid state active micro cooling chip revolutionizing thermal management for ultra-mobile systems and next-generation artificial intelligence (AI) solutions
Thermal management is increasingly challenging, and passive heat spreaders are no longer sufficient on their own. xMEMS active µCooling, all-silicon, solid state, fan on a chip, can effectively generate airflow and quickly dissipates heat, enabling smartphones and other thin mobile electronics to operate that their maximum performance potential, without throttling.
All-Silicon, Solid-State Fan on A Chip for Active Micro Cooling
As the world’s first 1mm-thin active micro cooling fan on a chip, XMC-2400 is designed to actively cool even the thinnest handheld form factors.
Bi-directional flow rate, adjustable up to 39cc/sec
xMEMS’ active µCooling enables mobile devices to sustain maximum performance at lower operating temperatures and without processor throttling.
