All-silicon, solid-state active thermal management solution for Edge AI devices and low-power data center subsystems
Thin
Power
Airflow
Water and Dust
Vibration-free
µCooling™ delivers hyper-local, targeted airflow exactly where heat is generated, directly at the processor and other critical components, to manage heat.
µCooling powers ultra-thin, compact Edge AI devices with high-performance compute, increased power density, and advanced AI capabilities.
Silent, localized thermal management to maintain surface temperatures that remain cool against the skin.
Dissipating heat from AI processors inside increasingly compact enclosures.
The first-ever in-drive active cooling solution small enough to live inside the SSDs.
See how µCooling delivers an immediate temperature drop and up to 30°C ΔT versus passive cooling.
XMC-2400 samples are available now. Contact us to start evaluating µCooling for your next design.
µCooling fan-on-a-chip delivers targeted, silent cooling right where it’s needed, reducing temperatures by 10–20°C in spaces where liquid cooling can’t reach.
First in-module active cooling small enough to embed inside 400G, 800G, and 1.6T optical transceivers.
Delivers hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself.
Addresses hotspots in space-constrained edge deployments where liquid cooling is impractical.
See how µCooling lowers the PCB’s steady-state temperature to 64°C, compared to 77°C without it.
XMC-2400 samples are available now. Contact us to start evaluating µCooling for your next design.
AI Glasses, Microdisplays, Wearables & Headphones
Dimensions
5 x 8 x 1.14 mm
Airflow
Up to 10cc/s
Back Pressure
Up to 1,100 Pa
Power Consumption
~70mW
XR Glasses, Personal SSDs & Edge AI Apps
Dimensions
7.42 x 9.48 x 1.13 mm
Airflow
Up to 28cc/s
Back Pressure
Up to 1,300 Pa
Power Consumption
~150mW
Data Center SSDs & Smartphones
Dimensions
9.93 x 14.35 x 1.13 mm
Airflow
Up to 48cc/s (0.1 CFM)
Back Pressure
Up to 1,100 Pa
Power Consumption
~240mW
01 Piezoelectric Actuation
Thin-film piezoelectric material deposited on silicon expands and contracts at ultrasonic frequencies, converting electrical energy into mechanical motion.
02 Air Pulse Generation
Membranes vibrate above human hearing range, creating continuous high-velocity air pulses through precision micro-valve arrays on the chip.
03 Directed Airflow
Top-venting or side-venting packages direct cool air onto heat sources, or through isolated channels thermally coupled to target components.
04 Heat Dissipation
Localized forced convection dissipates heat from hotspots, sustaining component performance and extending hardware lifespan.
µCooling™ is an all-silicon, solid-state active cooling technology that delivers targeted airflow directly where heat is generated. Unlike traditional passive cooling solutions that only spread heat, µCooling actively moves air to help remove heat from processors and other critical components. The technology is built on xMEMS’ piezoMEMS platform and is designed for space-constrained devices such as AI glasses, smartphones, tablets, SSDs, and other Edge AI systems that can’t accommodate conventional fans.
Traditional fans rely on rotating blades and mechanical assemblies that consume space, generate noise, and can wear over time. µCooling uses microscopic silicon membranes vibrating at ultrasonic frequencies to create airflow without spinning blades. The result is a compact, solid-state cooling solution that is silent, vibration-free, and thin enough to fit inside devices where conventional fans cannot. µCooling supports automated pick-and-place assembly and surface mounting to rigid or flex PCBs for high-volume manufacturing.
AI applications such as large language models, computer vision, real-time translation, generative AI, and advanced video processing create sustained computing workloads that generate significant heat. As processors become more powerful, passive cooling methods alone can struggle to maintain performance. Active cooling helps prevent thermal buildup, reducing throttling and allowing devices to sustain higher performance for longer periods.
