Join us to experience our PiezoMEMS platform powering smaller, thinner and lighter GenAI voice interfaces in wearables and improved thermal performance for edge AI and data center systems.
Overcome Key Hardware Challenges
with xMEMS PiezoMEMS Technology
One PiezoMEMS Platform. Three Product Lines.
Endless Gen AI Possibilities.
Join us to experience xMEMS’ piezoMEMS platform, including active micro cooling (µCooling) fan-on-a-chip, Sycamore Loudspeaker, and Cypress and Lassen in-ear micro speakers driving the next wave of high performance electronics for the GenAI era.
See live demos, use cases across edge AI devices, smart wearables and AI data centers, and hear from industry leaders in exclusive keynotes.
Are you ready to unlock new levels of performance and break through today’s hardware bottlenecks?
Solutions Across GenAI on Edge Devices, AI Infrastructure, and Smart Wearables
Preliminary Agenda
Sept 16 Taipei
Registration and xMEMS Product Demos
Sept 18 Shenzhen
Welcome Keynote
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µCooling
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Introduction and Design Concepts Modeling and Performance Results for Consumer and Datacenter Applications µCooling Component Measurement
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Lunch and xMEMS Product Demos
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µFidelity (Audio)
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Designing with Sycamore, the World’s First MEMS Near-Field Loudspeaker Sycamore Component and Distortion Measurement Headphones: Delivering a Spatial Accuracy Competitive Advantage with MEMS Speakers Designing with Cypress/Alta for ANC Earbuds
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Closing Remarks and xMEMS Product Demos
Venue
Illume Taipei
No. 100號, DunHua N Rd, Songshan District, Taipei City, Taiwan 105020.