SEPT 16, TAIPEI | SEPT 18, SHENZHEN
Join us to experience our PiezoMEMS platform powering smaller, thinner and lighter GenAI voice interfaces in wearables and improved thermal performance for edge AI and data center systems.
Join us to experience xMEMS’ piezoMEMS platform, including active micro cooling (µCooling) fan-on-a-chip, Sycamore Loudspeaker, and Cypress and Lassen in-ear micro speakers driving the next wave of high performance electronics for the GenAI era.
See live demos, use cases across edge AI devices, smart wearables and AI data centers, and hear from industry leaders in exclusive keynotes.
Are you ready to unlock new levels of performance and break through today’s hardware bottlenecks?
SESSIONS
Registration and xMEMS Product Demos
Welcome: xMEMS, At the Heart of Edge AI
Mike Housholder, VP of Marketing & Business Development
µCooling Introduction and Design Concepts
Mike Housholder, VP of Marketing & Business Development
Tom Tarter, Principal Thermal Engineer
µCooling Application Modeling and Performance
Tom Tarter, Principal Thermal Engineer
µCooling Component Measurement
Tom Tarter, Principal Thermal Engineer
Lunch Buffet and xMEMS Product Demos
Designing with Sycamore, the World’s First MEMS Near-Field Loudspeaker
Robb Zimmerman, Principal Systems Engineer
Sycamore Distortion Measurement
Steve Temme, Founder & CEO, Listen, Inc.
Coffee, Tea and xMEMS Product Demos
Headphones: Delivering a spatial accuracy competitive advantage through 2-way and full-range MEMS design
Pierce Hening, Senior Acoustic Engineer
Designing with Cypress for ANC Earbuds
Yanchen Li, VP of Systems Engineering
Closing Remarks
Steven Bentley, VP of Sales
Coffee, Tea and xMEMS Product Demos
No. 100號, DunHua N Rd, Songshan District, Taipei City, Taiwan 105020.
9028 Shennan Road, Shenzhen, Guangdong Province, China, 518000
Registration and xMEMS Product Demos
Welcome Keynote
µCooling
Introduction and Design Concepts
Modeling and Performance Results for Consumer and Datacenter Applications
µCooling Component Measurement
Lunch and xMEMS Product Demos
µFidelity (Audio)
Designing with Sycamore, the World’s First MEMS Near-Field Loudspeaker
Sycamore Component and Distortion Measurement
Headphones: Delivering a Spatial Accuracy Competitive Advantage with MEMS Speakers
Designing with Cypress/Alta for ANC Earbuds
Closing Remarks and xMEMS Product Demos
No. 100號, DunHua N Rd, Songshan District, Taipei City, Taiwan 105020.
9028 Shennan Road, Shenzhen, Guangdong Province, China, 518000
Just added!
Registration and xMEMS Product Demos
Welcome: xMEMS, The New Chapter
Keynote: Market Adoption of Solid-State Fidelity µSpeakers, Awards and Testimony, Reference Designs
Sound from Ultrasound: Sound-from-ultrasound Principle, Full range In-ear µspeaker Performance
Lunch Buffet and xMEMS Product Demos
Keynote: Skyline DynamicVent, Applications and Reference Designs
The xMEMS Presidio 2-way Headphone Reference Design Review: Sound Quality and Comfort Enhancements and Time-to-market Benefits
Guest Speaker – Creative Technology Ltd.
New xMEMS-enabled Products
Coffee, Tea, and xMEMS Product Demos
Keynote: System Thermal Challenges for Compact Devices, xMEMS µcooling Introduction, Performance and System Integration
Closing Remark
xMEMS Product Demos
World’s most innovative piezoMEMS silicon platform
HEADQUARTERS
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