Introducing XMC-1200, enabling sustained AI performance, extended video recording and color-accurate displays.
A breakthrough full-range MEMS speaker for open-air listening, built on Sound from Ultrasound platform
Maximize Edge AI performance
with uCooling fan-on-a-chip
Eliminate throttling and maintain peak data rates with xMEMS uCooling air-pump-on-a-chip
Transforming AI voice interactions with Sycamore near-field MEMS Loudspeaker
Eliminate thermal throttling, enhance clarity for AI voice interactions, and enable higher-performing, thinner and lighter devices with xMEMS PiezoMEMS components.
Improves performance for compact Edge AI devices and low-power data center subsystems.
Elevates AI voice clarity for smaller, thinner and lighter smart wearables.
Our solutions are key enablers in the evolving Physical AI ecosystem, addressing critical hardware challenges: thermal limits, compact form factors, and high-clarity voice interfaces.
Pioneering a New Era in Consumer Electronics with Piezo MEMS InnovationsÂ
xMEMS’ Piezo MEMS Silicon Solutions are based on the inverse piezoelectric effect created by applying an input voltage to make the piezo MEMS material contract or expand, converting electrical energy to mechanical energy. This energy excites an integrated silicon membrane to generate airflow and/or pressure.
