The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
Cooling, Reimagined in Silicon
Experience the World’s Smallest Active Micro-Fan for Smart Glasses
Introducing XMC-1200, enabling sustained AI performance, extended video recording and color-accurate displays.
Learn More
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
2-way over-ear headphone reference designs based on xMEMS’ MEMS Speakers
Improved spatial audio precision and reduced weight for gamers through a strategic partnership with ODMs AMPACS and Merry Electronics.
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s Thinnest Active Thermal Management Solution for Smartphones
Maximize Edge AI performance
with µCooling™ fan-on-a-chip
Learn more
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s First AI Glasses Active Thermal Management Powered by µCooling™
- Reduced thermal throttling
- Reduced surface temperature
- Extended video capture / display times
Learn More
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s Smallest Active Thermal Solution for SSDs
Eliminate throttling and maintain peak data rates with xMEMS’ µCooling air-pump-on-a-chip
Read more
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s Thinnest and Lightest Speaker for Smart Watches
Transforming AI voice interactions with Sycamore near-field MEMS Loudspeaker
Learn more
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
Cooling, Reimagined in Silicon
Experience the World’s Smallest Active Micro-Fan for Smart Glasses
Introducing XMC-1200, enabling sustained AI performance, extended video recording and color-accurate displays.
Learn More
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
2-way over-ear headphone reference designs based on xMEMS’ MEMS Speakers
Improved spatial audio precision and reduced weight for gamers through a strategic partnership with ODMs AMPACS and Merry Electronics.
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s Thinnest Active Thermal Management Solution for Smartphones
Maximize Edge AI performance
with µCooling™ fan-on-a-chip
Learn more
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s First AI Glasses Active Thermal Management Powered by µCooling™
- Reduced thermal throttling
- Reduced surface temperature
- Extended video capture / display times
Learn More
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s Smallest Active Thermal Solution for SSDs
Eliminate throttling and maintain peak data rates with xMEMS’ µCooling air-pump-on-a-chip
Read more
The “X” Factor in MEMS Innovations
World’s most innovative piezoMEMS silicon platform presents
The World’s Thinnest and Lightest Speaker for Smart Watches
Transforming AI voice interactions with Sycamore near-field MEMS Loudspeaker
Solutions
Next-Level Performance, Small Size, Robustness & Efficiency, Harnessing the Power of Solid-State, All-Silicon Piezo MEMS Technology
MEMS Speakers
For personal audio & smart wearables
Deliver enhanced consumer audio experiences with unmatched clarity, detail, and spatial imaging.
Active Acoustic Vents
For personal audio
Add active vent control to balance occlusion effects and active noise canceling (ANC) performance.
Micro Cooling
For mobile electronics
World’s first 1mm-thin all-silicon, solid state Active Micro Cooling Fan on a Chip for smartphones, tablets and other thin mobile electronics.
Solutions Driving the Future of Edge AI Thermal Management and AI Audio Interactions
Eliminate thermal throttling, enhance clarity for AI voice interactions, and enable higher-performing, thinner and lighter devices with xMEMS PiezoMEMS components.
Improves performance for compact Edge AI devices and low-power data center subsystems.
Elevates AI voice clarity for smaller, thinner and lighter smart wearables.
One PiezoMEMS Platform Powering Thin, Lightweight, High-Performing Devices
Our solutions are key enablers in the evolving Physical AI ecosystem, addressing critical hardware challenges: thermal limits, compact form factors, and high-clarity voice interfaces.
Technology
Pioneering a New Era in Consumer Electronics with Piezo MEMS Innovations
xMEMS’ novel all-silicon, solid-state piezoMEMS platform is transforming consumer electronics industries, spanning personal audio, smartphones, laptops, tablets, AR/VR goggles, and in-cabin automotive entertainment, with nearly 300 granted patents worldwide.
xMEMS’ Piezo MEMS Silicon Solutions are based on the inverse piezoelectric effect created by applying an input voltage to make the piezo MEMS material contract or expand, converting electrical energy to mechanical energy. This energy excites an integrated silicon membrane to generate airflow and/or pressure.
